As AI drives data transfer demand, NLM closes Series A financing led by Emerald Technology Ventures, with Oregon Venture Fund, Idemitsu, and others to scale our technology. NLM demonstrates an industry-first 1.6T multi-channel PIC using silicon-organic hybrid (SOH) technology at OFC 50, quickly followed by a 3.2T PIC. Both utilize our patented Selerion™ family of OEO technology. These devices have record-setting results and showcase real-world improvements in 200G and path to 400G in multi-channel SOH PICs. NLM’s chips now orbit Earth on the International Space Station where they’re subjected to the extremes of space!