Silicon Photonics Push Beyond 200G: NLM to Unveil Third-Party Test Results at ECOC 2025
NLM Photonics, a leader in hybrid organic electro-optic (OEO) technology, will announce record-setting, third-party test results at ECOC 2025. The results confirm that NLM’s patented silicon organic hybrid (SOH) photonic integrated circuits (PICs) can be manufactured on commercially available silicon photonics platforms to scale beyond 200G.
NLM announced their 1.6T PIC design at OFC. This eight-channel PIC leverages NLM’s Selerion™-HTX OEO technology. Now, independent testing conducted in collaboration with Keysight Technologies and VLC Photonics has validated record bandwidth performance and data transmission rates to deliver 1.6T (8x200G) and 3.2T (8x400G) capabilities, significantly outstripping traditional silicon photonics.
NLM CEO Brad Booth and CTO Dr. Lewis Johnson will be at ECOC 2025 September 29 through October 2 to share additional insights and detailed results. To arrange a meeting, please contact [email protected].
About NLM Photonics
NLM Photonics develops cutting-edge organic electro-optic modulation technology transforming data centers, AI, communications, and quantum computing. Our patented OEO technology enables higher bandwidth and lower power consumption while requiring minimal process disruption, helping solve critical challenges in efficiency and sustainability. Built on over two decades of research and development, technology breakthroughs enable the next generation of high-performance communication. Find us at nlmphotonics.com and on LinkedIn @nlm-photonics.
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